04368CBLBB-25

04368CBLBB-25

$68.76
  • Description:IC SRAM 8MBIT HSTL 153BGA
  • Series:-
  • Mfr:IBM
  • Package:Bulk

SKU:b7c877d57a7d Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SRAM 8MBIT HSTL 153BGA
  • Series:-
  • Mfr:IBM
  • Package:Bulk
  • Memory Type:-
  • Memory Format:SRAM
  • Technology:-
  • Memory Size:8Mbit
  • Memory Organization:256K x 36
  • Memory Interface:HSTL
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:-
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:153-BGA
  • Supplier Device Package:153-BGA
  • Access Time:-

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04368CBLBB-25

Overview

The IBM 04368CBLBB-25 is an 8 Mbit Static Random Access Memory (SRAM) integrated circuit. It utilizes High-Speed Transceiver Logic (HSTL) interface standards to ensure signal integrity in high-speed digital systems. The component is housed in a 153-ball Ball Grid Array (BGA) package, providing a compact form factor suitable for dense printed circuit board layouts. This memory device is designed for applications requiring fast data access and reliable storage within electronic equipment.

Feature Summary

  • Provides 8 Mbit non-volatile or volatile SRAM storage capacity
  • Supports HSTL signaling standards for high-speed data transmission
  • Utilizes a 153-ball BGA package for space-efficient mounting

Applications

  • High-speed digital logic circuits
  • Embedded memory systems
  • Data buffering in communication equipment

Procurement Notes

Verify the specific datasheet version and revision level before procurement, as IBM semiconductor documentation may vary by production batch. Confirm that the 153-ball BGA pinout matches your design requirements exactly. Ensure compatibility with HSTL voltage levels specified in the official technical reference. Check for any end-of-life notices or obsolescence warnings associated with this part number from authorized distributors.

Selection Notes

Select this component when an 8 Mbit SRAM solution with HSTL compatibility is required. The 153-ball BGA package necessitates PCB designs capable of handling fine-pitch surface mount technology. Consider thermal dissipation characteristics inherent to BGA packages during layout. Verify that the system architecture supports the specific timing parameters defined for HSTL interfaces to ensure proper operation.

Part Context

This part belongs to IBM's historical portfolio of embedded memory solutions. It represents a specific configuration within the broader category of SRAM devices used in enterprise and industrial electronics. The designation indicates a specific density and packaging variant produced by IBM for specialized computing applications.

Replacement Considerations

Consult official IBM replacement guides or authorized distributor cross-reference lists for verified substitutes. Generic SRAM replacements may not match the HSTL electrical characteristics or the 153-ball BGA footprint. Ensure any alternative component maintains identical pin assignments and voltage specifications to avoid redesign.

04368CBLBB-2504368CBLBB-25
$68.76
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