04EM04-N3GM627-GA06U

Overview

The Kingston 04EM04-N3GM627-GA06U is an embedded multi-chip package (eMCP) integrating a 4 Gbit MLC NAND flash with an eMMC 5.1 controller and a 4 Gbit LPDDR3 SDRAM. It utilizes a JEDEC 221-ball FBGA package measuring 11.5 mm x 13.0 mm with a maximum height of 1.0 mm. The device operates within a temperature range of -25°C to +85°C, supporting VCC at 3.3V and VCCQ at 1.8V or 3.3V. In HS400 mode, it achieves typical sequential read speeds of 250 MB/s and write speeds of 25 MB/s.

Feature Summary

• Integrates managed NAND flash storage and low-power DRAM into a single compact package to reduce PCB footprint.
• Features an onboard eMMC controller that manages error control, wear-leveling, and performance optimization.
• Supports high-speed data transfer modes including HS400 for enhanced throughput in mobile systems.

Applications

• Data memory for mobile communication systems
• Embedded computing platforms requiring integrated storage and memory
• IoT devices with space constraints

Procurement Notes

Verify the specific revision level and date code against current manufacturing records before integration. Confirm voltage requirements match the host system design, particularly regarding VCCQ compatibility with HS400 modes. Ensure ESD protection protocols are followed during handling due to moisture sensitivity classification.

Selection Notes

Select this component when a unified solution for non-volatile storage and volatile memory is required to minimize board space. It is suitable for designs needing eMMC 5.1 compliance with high-speed interface capabilities. Consider the operating temperature range and power consumption profiles relative to the target application environment.

Part Context

This part belongs to Kingston's embedded multi-chip package series designed for commercial and industrial applications. It combines industry-standard interfaces with proprietary management algorithms to ensure reliability. The device simplifies system design by replacing separate discrete components with a single integrated unit.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation.