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The Knowles Syfer 0805J0250682MXTE07 is a surface-mount multilayer ceramic capacitor (MLCC) designed for general electronic applications. It features a capacitance of 2.2 nF with a tolerance of ±20% and a rated DC voltage of 25V. The component utilizes X7R dielectric material, providing stable performance across an operating temperature range of -55°C to +125°C. Housed in a standard 0805 (2012 metric) package measuring 2.00mm x 1.25mm, it incorporates a nickel barrier electrode structure terminated with 100% tin plating. This construction supports its classification as an EMI filter component within the XT series.
Verify the specific ordering suffix MXTE07 to ensure correct packaging and termination specifications. Confirm that the X7R dielectric and 25V rating align with the target application's thermal and electrical requirements. Check current availability status as lead times may vary due to manufacturing schedules. Ensure compliance with RoHS3 standards if required by the end-product regulations.
Select this component when a 2.2 nF capacitance value is required for EMI filtering or coupling in space-constrained designs. The 0805 footprint offers a balance between capacitance density and board real estate. Consider the X7R temperature coefficient characteristics against alternative C0G/NP0 types if tighter stability is needed. Verify that the 25V rating provides sufficient margin for the maximum operating voltage in the circuit.
This part belongs to the Knowles Syfer XT series, which focuses on high-reliability MLCCs. The 0805J prefix indicates the 0805 case size and 25V voltage class. The 'M' denotes the X7R dielectric, while 'XTE07' specifies the reel packaging and terminal configuration. It is distinct from the C0G/NP0 variants in the same series, offering different stability and cost profiles.
Direct substitutes must match the 0805 footprint, 2.2 nF capacitance, 25V rating, and X7R dielectric. Verify that alternative manufacturers offer identical nickel barrier/tin termination structures to ensure compatibility with existing assembly processes. Cross-reference datasheets for mechanical dimensions and soldering profile recommendations.