0819-54G

Overview

The Delevan 0819-54G is an axial leaded RF inductor featuring a molded unshielded coil construction. It provides an inductance of 18 µH with a tight tolerance of ±2%. The component exhibits a maximum DC resistance of 3.8 ohms and supports a maximum DC current of 112 mA. Key electrical characteristics include a minimum quality factor of 40 and a self-resonant frequency of 23 MHz. Designed for PCB mounting, it measures 5.08 mm in length and 1.98 mm in diameter.

Feature Summary

• Molded unshielded coil design for RF applications
• Axial leaded termination style for through-hole mounting
• High precision inductance tolerance

Applications

• RF circuit filtering
• Impedance matching networks
• Signal processing stages

Procurement Notes

Verify the specific ordering suffix to ensure correct tolerance and packaging configuration. Confirm that the axial lead form factor aligns with the target PCB layout requirements. Cross-reference the manufacturer datasheet for environmental compliance status and detailed mechanical dimensions prior to finalizing procurement specifications.

Selection Notes

Select this component when a precise 18 µH inductance value is required for RF signal paths. Ensure the operating current remains below the 112 mA limit to prevent saturation. Verify that the 23 MHz self-resonant frequency does not interfere with the intended signal bandwidth. Consider the unshielded nature regarding potential magnetic coupling with adjacent components.

Part Context

This part belongs to the Delevan 0819 series of fixed RF inductors. The series offers various inductance values tailored for radio frequency environments. The 0819-54G specifically targets applications requiring stable performance at moderate frequencies with strict tolerance requirements.

Replacement Considerations

Direct substitutes within the same series include parts with identical inductance but different tolerances, such as the 0819R-54H which offers a 3% tolerance. Verify that alternative components match the physical footprint and electrical parameters before implementation.