08EM08-N3GML36-01B00

Overview

The Kingston 08EM08-N3GML36-01B00 is an Embedded Multi-Chip Package (eMCP) integrating 8GB NAND flash and 8Gb LPDDR3 DRAM. It adheres to eMMC 5.1 and LPDDR3 standards within a 221-ball FBGA package measuring 11.5x13.0x1.0 mm. The component operates across a temperature range of -25°C to +85°C, providing a compact storage and memory solution for space-constrained embedded systems.

Feature Summary

• Integrates managed NAND flash and low-power DRAM into a single multi-chip package to reduce system footprint.
• Utilizes industry-standard eMMC interface to simplify host design complexity and qualification cycles.
• Optimized for battery-powered applications through reduced power consumption and lower bill of material complexity.

Applications

• Wearable devices
• Mobile IoT products
• Smartphones and tablets

Procurement Notes

Verify the specific ordering suffix against official documentation to confirm firmware configuration or voltage variants. Ensure compatibility with the target system's eMMC 5.1 controller and LPDDR3 interface requirements before procurement.

Selection Notes

Select this component for designs requiring high integration in small form factors. Consider the -25°C to +85°C operating range for industrial or mobile environments. Evaluate power efficiency needs as the LPDDR3 architecture supports battery-operated use cases effectively.

Part Context

This part belongs to Kingston's eMCP portfolio, which combines eMMC storage with LPDDR memory. These solutions are engineered for mobile and IoT markets, offering simplified design processes and reduced board space compared to discrete components.

Replacement Considerations

Consult official Kingston documentation for verified substitute part numbers. Cross-referencing requires matching capacity, standard versions, package dimensions, and thermal specifications.