08EP08-N3GTC32-GA67

Overview

The Kingston Technology 08EP08-N3GTC32-GA67 is an Embedded Package on Package (ePOP) device integrating e•MMC™ 5.1 storage and LPDDR3 DRAM. It features 8GB NAND density and 8Gb DRAM density in a 136-ball FBGA package measuring 10.0 mm x 10.0 mm with a maximum height of 0.85mm. The nominal operating voltage is VCC=3.3V, VCCQ=1.8V/3.3V, VDD1=1.8V, and VDD2/VDDQ=1.2V. Sequential read performance reaches 280 MB/s and write performance reaches 110 MB/s at HS400 mode. Operating temperature ranges from -25°C to +85°C.

Feature Summary

• Integrates managed NAND flash and LPDDR3 DRAM into a single multi-chip package to reduce PCB size and power consumption.
• Supports High Speed Single Data Rate (HS-200) and High Speed Dual Data Rate (HS-400) bus modes for high throughput.
• Includes onboard controller managing error control, wear-leveling, and IOPS optimization.
• Provides enhanced security features including secure block erase and Replay Protected Memory Block (RPMB).

Applications

• Mobile communication systems
• Embedded applications requiring compact memory solutions
• Commercial and industrial devices

Procurement Notes

Verify the specific part number against official Kingston documentation to ensure compatibility with target system interfaces. Confirm that the host controller supports the required e•MMC™ 5.1 specifications and LPDDR3 standards. Check for any recent product change notifications regarding component revisions or supply constraints before finalizing procurement plans.

Selection Notes

Select this component when system design requires combining storage and volatile memory in a minimal footprint. Ensure the application environment operates within the specified -25°C to +85°C temperature range. Verify that the host processor can support the necessary voltage levels and bus widths defined in the specification sheet.

Part Context

This ePOP device belongs to Kingston's embedded memory portfolio designed for space-constrained electronics. It combines industry-standard e•MMC™ interface protocols with low-power DRAM technology. The packaging allows for direct integration onto motherboards, simplifying assembly compared to discrete components.

Replacement Considerations

Consult Kingston technical support for verified substitute part numbers. Ensure any replacement maintains identical package dimensions, pin assignments, and electrical characteristics to guarantee mechanical and functional compatibility.