0W888-002-XTP

0W888-002-XTP

  • Description:DSP BELASIGNA 250 AUDIO 64LFBGA
  • Series:BelaSigna® 250

SKU:e1eb3dde1c3b Category: Brand:

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Product Detailed Parameters

  • Description:DSP BELASIGNA 250 AUDIO 64LFBGA
  • Series:BelaSigna® 250
  • Mfr:onsemi
  • Package:Tape & Reel (TR)
  • Type:Fixed/Floating Point
  • Interface:I2C, I2S, PCM, SPI, UART
  • Clock Rate:50MHz
  • Non-Volatile Memory:PRAM (24kB)
  • On-Chip RAM:16kB
  • Voltage - I/O:1.80V
  • Voltage - Core:1.80V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:64-LFBGA
  • Supplier Device Package:64-LFBGA (7x7)
  • Grade:-
  • Qualification:-

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0W888-002-XTP

Overview

The onsemi 0W888-002-XTP is a BELASIGNA 250 high-performance programmable audio processing system in a 64-ball LFBGA package. It integrates a 16-bit RCore DSP and a WOLA filterbank coprocessor for ultra-low-power embedded audio applications. The device operates on a 1.8 V supply, consuming under 5 mA at 20 MHz. Key electrical specifications include an 88 dB system dynamic range, 50 MHz maximum clock frequency, and integrated stereo 16-bit A/D converters with analog line-level or direct digital power outputs.

Feature Summary

  • Dual-subsystem architecture combining a fully software-programmable 16-bit RCore DSP and a dedicated WOLA filterbank coprocessor.
  • Integrated mixed-signal audio chain featuring stereo 16-bit A/D converters and powered analog/digital outputs.
  • Smart power management with soft power-down mode requiring only 0.05 mA standby current.
  • Flexible clocking supporting speeds up to 50 MHz with configurable interfaces including I2S, PCM, UART, SPI, and I2C.

Applications

  • Ultra-low-power portable digital audio systems
  • Embedded audio processing requiring advanced sound quality and flexibility
  • Devices utilizing direct digital power outputs connected to speakers

Procurement Notes

The 0W888-002-XTP is identified as an End-of-Life (EOL) product by the manufacturer. Availability is restricted, and procurement should focus on verifying stock status through authorized distributors. Designers must account for discontinuance when planning long-term production cycles.

Selection Notes

Select this component for applications requiring a complete mixed-signal audio solution within a single chip. Ensure PCB layout strictly separates analog ground (AGND) and digital ground (DGND) planes connected at a star point to maintain the specified 88 dB dynamic range. Verify that the 7x7 mm LFBGA footprint matches the design constraints.

Part Context

This part number corresponds to the BELASIGNA 250 series, specifically the 64-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA) variant. It builds upon the BELASIGNA 200 architecture to deliver enhanced audio fidelity and processing capabilities for portable electronics.

Replacement Considerations

As this component is discontinued, no direct public substitute is listed. Evaluate alternative audio DSPs from the same manufacturer or competitors that offer similar WOLA filterbank integration and low-power characteristics.

0W888-002-XTP0W888-002-XTP

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