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Product Detailed Parameters
- Description：CONN AMC B+ FEMALE 170POS 0.029
- Series：AdvancedTCA
- Mfr：TE Connectivity AMP Connectors
- Package：Bulk
- Card Type：Advanced Mezzanine Card B+, MicroTCA
- Gender：Female
- Number of Positions/Bay/Row：85
- Number of Positions：170
- Card Thickness：0.063" (1.60mm)
- Number of Rows：2
- Pitch：0.029" (0.75mm)
- Read Out：Dual
- Features：-
- Mounting Type：Through Hole, Right Angle
- Termination：Press-Fit
- Contact Material：Copper Alloy
- Contact Finish：Gold or Gold-Palladium
- Contact Finish Thickness：-
- Contact Type：-
- Color：Black
- Flange Feature：-
- Operating Temperature：-
Download product information
Overview
The TE Connectivity AMP Connectors part number 1-1367703-2 is a right-angle card edge connector belonging to the AMC B+ series. It features 170 positions designed for Advanced Mezzanine Card applications. The connector utilizes a female contact configuration with gold or gold-palladium plating on a 0.029-inch (0.75mm) pitch. Constructed with black thermoplastic insulation, it supports high-density interconnect requirements typical of MicroTCA and AMC systems.
Feature Summary
- Right-angle design facilitates compact board stacking in mezzanine architectures
- Gold or gold-palladium contact plating ensures reliable signal transmission
- Compatible with AMC B+ standard specifications for modular computing
Applications
- Advanced Mezzanine Card (AMC) module integration
- MicroTCA chassis backplane connections
- High-density data center server interconnects
Procurement Notes
Verify the specific contact plating option (gold versus gold-palladium) required for your application environment before ordering. Confirm that the right-angle orientation matches your PCB layout constraints. Ensure compatibility with the AMC B+ form factor standards. Check current availability status as electronic components may experience supply fluctuations.
Selection Notes
Select this component when designing systems requiring right-angle AMC B+ connectivity. Consider the 0.75mm pitch density for space-constrained layouts. Evaluate thermal management needs given the high pin count. Verify mating connector compatibility within the MicroTCA ecosystem.
Part Context
This connector is part of TE Connectivity's specialized lineup for advanced computing architectures. It serves as a critical interface between carrier boards and mezzanine modules. The product adheres to PICMG specifications for interoperability. It replaces older generation connectors offering improved signal integrity and mechanical stability.
Replacement Considerations
Consult official TE Connectivity substitution guides for verified alternatives. Generic card edge connectors may not meet AMC B+ mechanical tolerances. Ensure any substitute maintains the 0.75mm pitch and right-angle geometry.
