1-2328461-1

Overview

The TE Connectivity AMP Connectors model 1-2328461-1 is a high-density edgeboard connector belonging to the Sliver 2.0 series. It features a dual-edge female contact configuration with 280 positions and a 0.024-inch (0.60mm) pitch. Designed for vertical PCB mounting, it utilizes gold-plated contacts to ensure reliable signal integrity in high-speed applications. The component is specifically engineered to meet SFF-TA-1002 standards, supporting Gen-Z architecture requirements for server and storage systems.

Feature Summary

• Protocol-agnostic multi-lane high-speed connectivity design
• Vertical PCB edge card mounting configuration
• Compliance with SFF-TA-1002 internal I/O standards

Applications

• Gen-Z standard applications
• Server internal interconnects
• Storage system backplanes

Procurement Notes

Verify the specific datasheet revision and RoHS compliance status prior to procurement. Confirm that the vertical mounting orientation matches the mechanical constraints of the target PCB layout. Ensure compatibility with the mating card edge thickness and plating specifications required by the system design.

Selection Notes

Select this component when a protocol-agnostic solution is required for high-speed data transmission in server environments. The dual-edge design accommodates complex signal routing needs while adhering to SFF-TA-1002 form factors. Evaluate thermal management requirements as the high pin count may influence local board temperatures during operation.

Part Context

This part belongs to the Sliver 2.0 family, which provides standardized high-speed interconnect solutions. It serves as a critical interface between host processors and peripheral devices in modern computing architectures. The series emphasizes signal integrity and mechanical reliability for demanding industrial and data center applications.

Replacement Considerations

No public confirmed substitute part numbers are available.