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Product Detailed Parameters
- Description：PCIE GEN4, 98POS ,15U" ,DIP ,2.3
- Series：-
- Mfr：TE Connectivity AMP Connectors
- Package：Tray
- Card Type：Non Specified - Dual Edge
- Gender：Female
- Number of Positions/Bay/Row：11; 38
- Number of Positions：98
- Card Thickness：0.062" (1.57mm)
- Number of Rows：2
- Pitch：0.039" (1.00mm)
- Read Out：Dual
- Features：Board Guide, Locking Ramp
- Mounting Type：Through Hole
- Termination：Solder
- Contact Material：Phosphor Bronze
- Contact Finish：Gold
- Contact Finish Thickness：15.0µin (0.38µm)
- Contact Type：Cantilever
- Color：Black
- Flange Feature：-
- Operating Temperature：-40°C ~ 85°C
Download product information
Overview
The 1-2362375-3 is a 98-position female edgeboard connector manufactured by TE Connectivity AMP Connectors. It features dual gold contacts with a pitch of 0.039 inches (1.00mm) and a contact thickness of 15 microinches. Designed for PCI Express Generation 4 signal applications, this component utilizes a DIP mounting style to ensure reliable high-speed data transmission in demanding electronic environments.
Feature Summary
- Supports PCI Express Generation 4 standards for high-speed signal integrity
- Features dual gold-plated contacts for enhanced conductivity
- Utilizes a DIP mounting configuration for secure board integration
Applications
- PCI Express Generation 4 signal applications
- High-speed data transmission systems
- Edgeboard interconnect solutions
Procurement Notes
Verify the specific ordering suffix against official manufacturer documentation to confirm exact pin count, contact plating specifications, and mounting style compatibility. Ensure that the selected variant aligns with the required PCI Express Generation 4 performance standards and physical interface dimensions before finalizing procurement decisions.
Selection Notes
Select this component when designing systems requiring robust PCI Express Generation 4 connectivity. The dual gold contact configuration provides necessary durability for repeated mating cycles. Verify that the 1.00mm pitch and DIP form factor fit within the available PCB space constraints and mechanical assembly requirements of the target application.
Part Context
This part belongs to the TE Connectivity AMP Connectors portfolio, specializing in high-reliability interconnect solutions. The series is engineered for rigorous electronic environments, ensuring stable connections across various industrial and computing applications through precise manufacturing standards and validated material properties.
Replacement Considerations
Consult official cross-reference lists for verified substitute part numbers. Do not assume generic interchangeability between different series or manufacturers without confirming identical electrical parameters, mechanical dimensions, and compliance certifications.
