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Product Detailed Parameters
- Description：CONN PCI CARDEDGE FML 120P 0.050
- Series：Standard Edge .050
- Mfr：TE Connectivity AMP Connectors
- Package：Bulk
- Card Type：PCI™
- Gender：Female
- Number of Positions/Bay/Row：11; 49
- Number of Positions：120
- Card Thickness：0.062" (1.57mm)
- Number of Rows：2
- Pitch：0.050" (1.27mm)
- Read Out：Dual
- Features：Board Lock
- Mounting Type：Through Hole
- Termination：Solder, Staggered
- Contact Material：Phosphor Bronze
- Contact Finish：Gold
- Contact Finish Thickness：30.0µin (0.76µm)
- Contact Type：-
- Color：Natural
- Flange Feature：-
- Operating Temperature：-
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Overview
The 1-5145167-2 is a dual-edge female connector assembly from the TE Connectivity AMP Connectors PCI™ series. It features 120 positions with a 0.050-inch (1.27mm) contact spacing. The contacts are gold-plated phosphor bronze, and the housing is natural-colored polyphenylene sulfide. Designed for board-to-board or backplane applications, it utilizes a through-hole termination method with board lock features to ensure secure mechanical retention during operation.
Feature Summary
- Dual-edge configuration supporting high-density signal transmission
- Gold-plated contacts for reliable conductivity and corrosion resistance
- Integrated board lock mechanism for enhanced mechanical stability
- Polyphenylene sulfide insulation material for thermal durability
Applications
- PCI Express card edge connections
- High-speed data backplane interconnects
- Industrial control system board assemblies
Procurement Notes
Verify that the specific part number matches the required 120-position dual-edge specification. Confirm that the gold plating thickness and housing material align with the design requirements for the intended application environment. Ensure compatibility with mating card edge thicknesses and PCB mounting standards before finalizing procurement orders.
Selection Notes
Select this component when a high-density dual-edge interface is required for PCI or similar bus architectures. Consider the 0.050-inch pitch and gold contact finish for applications demanding robust signal integrity. Evaluate the board lock feature necessity for vibration-prone environments compared to standard unsecured connectors.
Part Context
This component belongs to the TE Connectivity AMP Connectors PCI™ series, designed specifically for high-performance computing and communication infrastructure. It serves as a critical interconnect solution within larger electronic systems requiring reliable high-speed data transfer capabilities between circuit boards.
Replacement Considerations
No public confirmed substitute part numbers are available in the provided documentation.
