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Product Detailed Parameters
- Description：CONN EDGE DUAL FML 360POS 0.100
- Series：-
- Mfr：TE Connectivity AMP Connectors
- Package：Bulk
- Card Type：Non Specified - Dual Edge, Bi-Level
- Gender：Female
- Number of Positions/Bay/Row：-
- Number of Positions：360
- Card Thickness：0.054" ~ 0.070" (1.37mm ~ 1.78mm)
- Number of Rows：2
- Pitch：0.100" (2.54mm)
- Read Out：Dual
- Features：Bi-Level - High Density, Board Lock
- Mounting Type：Through Hole
- Termination：Solder
- Contact Material：Phosphor Bronze
- Contact Finish：Gold
- Contact Finish Thickness：30.0µin (0.76µm)
- Contact Type：-
- Color：Brown
- Flange Feature：-
- Operating Temperature：-
Download product information
Overview
TE Connectivity AMP Connectors part number 1-5145427-7 is a dual-edge, bi-level card edge connector with 360 positions. It features gold contact finish and a pitch of 0.100 inches (2.54 mm). The housing is brown, non-specified card type. This component is designed for board-to-board or backplane interconnections requiring high-density signal routing.
Feature Summary
- Dual-edge configuration supporting bi-level mating
- Gold-plated contacts for reliable signal transmission
- High-density 360-position layout
Applications
- High-density electronic assemblies
- Backplane interconnection systems
- Board-to-board signal routing
Procurement Notes
Verify the exact pin count and electrical ratings against the official TE Connectivity datasheet before integration. Confirm that the dual-edge bi-level form factor matches your PCB design requirements. Ensure compatibility with mating connectors in your specific application environment.
Selection Notes
Select this component when a high-density, dual-edge solution is required. The 0.100-inch pitch allows for significant I/O density within a compact footprint. Consider the bi-level nature for complex signal layering needs in your system architecture.
Part Context
This connector belongs to the TE Connectivity AMP Connectors portfolio, specifically designed for robust electronic interconnects. It serves as a critical interface component in systems demanding high reliability and dense signal pathways across multiple circuit layers.
Replacement Considerations
No public confirmed substitute part numbers are available in the provided documentation. Consult TE Connectivity directly for potential obsolescence management or alternative solutions if this specific part number becomes unavailable.
