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1-5583485-2 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists TE Connectivity AMP Connectors. Its product description is CONN EDGE DUAL FMALE 20POS 0.100. Review the specifications below when checking this part for your BOM.
Edgeboard Connectors specifications for 1-5583485-2
- Description：CONN EDGE DUAL FMALE 20POS 0.100
- Series：TWIN LEAF
- Mfr：TE Connectivity AMP Connectors
- Package：Tray
- Card Type：Non Specified - Dual Edge
- Gender：Female
- Number of Positions/Bay/Row：-
- Number of Positions：20
- Card Thickness：0.055" ~ 0.070" (1.40mm ~ 1.78mm)
- Number of Rows：2
- Pitch：0.100" (2.54mm)
- Read Out：Dual
- Features：-
- Mounting Type：Through Hole
- Termination：Solder
- Contact Material：Phosphor Bronze
- Contact Finish：Gold
- Contact Finish Thickness：-
- Contact Type：-
- Color：Black
- Flange Feature：-
- Operating Temperature：-
Edgeboard Connectors datasheet and documents for 1-5583485-2
Edgeboard Connectors Overview
The 1-5583485-2 is a dual female edge connector manufactured by TE Connectivity AMP Connectors. It features 20 positions with a 0.100-inch (2.54 mm) pitch. Designed for high-density interconnect applications, this header utilizes through-hole termination for secure PCB mounting. The contacts are gold-plated to ensure reliable signal transmission and corrosion resistance in demanding environments.
Edgeboard Connectors Feature Summary
- High-density design optimized for space-constrained electronic assemblies
- Gold-plated contact surfaces for enhanced conductivity and durability
- Through-hole termination method ensures robust mechanical stability
Edgeboard Connectors Applications
- High-density backplane interconnections
- Industrial control system modules
- Telecommunications equipment interfaces
Edgeboard Connectors Procurement Notes
Verify the specific ordering suffix against official TE Connectivity documentation to confirm exact pin count and mating specifications. Ensure compatibility with existing board layouts and mating connectors before procurement. Cross-reference part numbers with current manufacturer databases to avoid obsolete or variant mismatches.
Edgeboard Connectors Selection Notes
Select this component when high-density routing is required within standard 0.100-inch grid constraints. Evaluate thermal management requirements due to the dense pin configuration. Confirm that the through-hole footprint aligns with manufacturing capabilities and that the gold plating thickness meets long-term reliability standards for the intended operational environment.
Edgeboard Connectors Part Context
This component belongs to the HDI (High Density Interconnect) series of TE Connectivity AMP Connectors. The series focuses on maximizing connection density within limited board areas while maintaining electrical integrity. It serves as a critical interface element in complex multi-layer circuit boards requiring reliable signal paths.
Edgeboard Connectors FAQ
What is the contact material finish?
The contacts feature a gold plating finish to ensure reliable performance.
Is this connector insulated?
The provided data does not specify insulation details for this specific part number.
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