1-5583715-3

Edgeboard Connectors Overview

The TE Connectivity AMP Connectors part number 1-5583715-3 is a dual-edge card edge connector designed for high-density PCB applications. It features a twin-leaf configuration with 30 positions and a contact pitch of 0.100 inches (2.54 mm). The connector utilizes female contacts to mate with corresponding board edges, ensuring reliable electrical interconnection in demanding environments.

Edgeboard Connectors Feature Summary

• Dual-edge design accommodates twin-leaf mating for enhanced stability
• Female contact configuration ensures secure board engagement
• Standard 0.100 inch pitch supports widespread PCB layout compatibility

Edgeboard Connectors Applications

• High-density printed circuit board interconnections
• Industrial control system backplanes
• Telecommunications equipment signal routing

Edgeboard Connectors Procurement Notes

Verify the specific position count and contact type against the official datasheet before procurement. Confirm that the dual-edge requirement matches the target PCB design specifications. Ensure environmental ratings align with the operational conditions of the final assembly to guarantee long-term reliability.

Edgeboard Connectors Selection Notes

Select this component when a robust dual-edge interface is required for 30-position connections. The standard pitch simplifies PCB footprint design. Evaluate mechanical retention needs as this style relies on board slot friction or additional locking mechanisms for secure attachment during operation.

Edgeboard Connectors Part Context

This component belongs to the standard card edge connector family from TE Connectivity. It serves as a critical interface between rigid PCBs and mating systems. The twin-leaf architecture distinguishes it from single-edge variants by providing improved alignment and contact integrity for complex electronic assemblies.

Edgeboard Connectors Replacement Considerations

Direct substitutes must match the 30-position count, dual-edge female configuration, and 0.100-inch pitch. Verify mechanical dimensions and material compatibility to ensure seamless integration without redesigning the host PCB footprint or housing constraints.