100-1215-1

Overview

The BECOM Systems GmbH 100-1215-1 is an eCM-BF561 core module based on the Blackfin series. It integrates a dual-core processor with up to 600MHz clock speed, 128MB SDRAM, and 32MB Flash memory. The module features two 100-pin expansion connectors for interface connectivity. Physical dimensions are 44mm x 33mm. It operates within an industrial temperature range of -40°C to 85°C and complies with RoHS3 standards.

Feature Summary

• Integrates dual-core Blackfin processor with high-speed memory components
• Provides dual 100-pin expansion connectors for system interfacing
• Designed for industrial environments with wide operating temperature support

Applications

• Industrial control systems requiring embedded processing
• Embedded applications needing parallel data handling
• Compact hardware designs constrained by small form factor requirements

Procurement Notes

Verify component authenticity through authorized BECOM Systems distributors. Confirm datasheet revisions match project specifications. Ensure environmental ratings align with operational conditions. Check RoHS compliance documentation for regulatory adherence. Validate pinout compatibility with target carrier board design before integration.

Selection Notes

Choose this module when dual-core Blackfin performance is required in a compact footprint. Consider the integrated memory sizes against application needs. Evaluate the 100-pin connector interfaces for signal routing complexity. Assess industrial temperature range suitability for harsh environments. Compare physical dimensions against enclosure constraints during mechanical design.

Part Context

This module belongs to the eCM-BF561 series from BECOM Systems. It utilizes the Analog Devices Blackfin architecture. The series focuses on high-performance embedded processing. Modules in this line integrate processors with memory and interfaces. They target space-constrained industrial and commercial applications.

Replacement Considerations

Consult official BECOM Systems documentation for direct substitutes. Verify pin-to-pin compatibility if cross-referencing other modules. Ensure memory configurations match functional requirements. Check temperature ranges for environmental equivalence.