100122FC

Overview

The F100322FC is a high-speed ECL buffer manufactured by National Semiconductor, now part of Texas Instruments. It operates within a temperature range of -55 °C to 85 °C and draws a maximum supply current of 65 mA. The device utilizes a ceramic flatpack package with 24 terminals arranged in a quad configuration. Key physical specifications include a 1.27 mm terminal pitch and tin/lead (Sn/Pb) terminations. This component is designed for applications requiring fast signal buffering in digital logic systems.

Feature Summary

• High-speed ECL technology implementation
• Ceramic flatpack construction for thermal stability
• Quad terminal arrangement for dense mounting

Applications

• Digital logic signal buffering
• High-speed data transmission lines
• ECL circuit interfacing

Procurement Notes

Verify the manufacturer designation as National Semiconductor or Texas Instruments, as the company was acquired. Confirm the specific suffix 'FC' corresponds to the ceramic flatpack variant with tin/lead terminations. Check RoHS compliance status, as older ECL components may not meet current environmental standards. Ensure the operating temperature range meets system requirements.

Selection Notes

Select this component when high-speed ECL buffering is required in legacy or specialized systems. Consider the 24-pin ceramic flatpack form factor for compatibility with existing board layouts. Evaluate the 65 mA power consumption against available cooling solutions. Verify that the -55 °C to 85 °C range aligns with the operational environment.

Part Context

This part belongs to the National Semiconductor F100 series of ECL logic devices. These components were widely used in telecommunications and computing infrastructure before the industry transitioned to lower voltage standards. The F100322FC specifically serves as a buffer within this family, maintaining signal integrity at high frequencies.