SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Amphenol ICC (FCI) 10018783-00103TLF is a card edge connector designed for vertical through-hole mounting. It features a staggered solder termination and is constructed with copper alloy contacts finished with gold plating, specifically 30.0µin (0.76µm) thickness. The housing utilizes thermoplastic materials to ensure durability in electronic assemblies.
Verify the specific contact finish thickness of 30.0µin against project requirements. Confirm that the vertical through-hole mounting style aligns with the PCB layout. Ensure the copper alloy material meets environmental compliance standards for the intended application.
Select this component when vertical alignment and staggered soldering are required. The gold plating provides corrosion resistance. Verify compatibility with the mating card edge thickness and pitch specifications before integration into the design.
This part belongs to the Amphenol ICC (FCI) Edgeboard Connectors series. The manufacturer, formerly FCI, was acquired by Amphenol in 2016. This product line supports signal integrity and power management solutions for commercial electronics.
No public substitute part numbers are confirmed in the provided documentation. Consult official Amphenol catalogs for compatible alternatives if this specific configuration is unavailable.