10018783-10102TLF

Overview

The Amphenol ICC (FCI) 10018783-10102TLF is a PCI Express Gen 3 card edge connector designed for vertical through-hole mounting. It features 98 positions with a 1.00mm pitch, supporting high-speed data transmission standards. The connector utilizes gold-plated copper alloy contacts to ensure reliable signal integrity and low contact resistance. Rated for 1.1A current and 300VAC voltage, it operates within a temperature range of -55°C to +85°C. The housing is constructed from nylon, providing durability and insulation resistance of 1 GOhms.

Feature Summary

• Supports PCI Express Gen 3 interface specifications for high-bandwidth applications
• Vertical through-hole termination ensures secure PCB attachment
• Gold-plated contacts maintain consistent electrical performance over mating cycles

Applications

• High-performance computing systems requiring PCIe Gen 3 expansion slots
• Industrial control boards utilizing standard card edge form factors
• Telecommunications infrastructure equipment needing reliable signal connectivity

Procurement Notes

Verify the specific suffix 'TLF' indicates lead-free compliance as per manufacturer standards. Confirm that the 98-position configuration matches the target motherboard slot dimensions. Ensure the vertical orientation aligns with the assembly requirements. Cross-reference the datasheet for any recent product change notifications affecting pinout or material composition before finalizing orders.

Selection Notes

Select this component when a 98-position vertical connector is required for PCI Express Gen 3 applications. The 1.00mm pitch dictates the compatible card edge thickness and trace spacing. Consider the through-hole mounting style for robust mechanical stability compared to surface mount alternatives. Verify that the 1.1A current rating meets the power distribution needs of the connected peripheral cards.

Part Context

This part belongs to the Amphenol FCI PCI Express connector family, specifically engineered for next-generation expansion interfaces. The 10018783 series represents a standardized solution for board-to-board connections in dense electronic assemblies. As an Amphenol ICC product, it integrates advanced plating technologies to support the demanding signal integrity requirements of modern high-speed digital protocols.

Replacement Considerations

Direct substitutes must match the 98-position count, 1.00mm pitch, and vertical through-hole mounting style. Verify compatibility with PCI Express Gen 3 electrical specifications. Ensure the replacement offers equivalent gold plating thickness and nylon housing material properties to maintain environmental and mechanical reliability.