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The Amphenol ICC (FCI) 10018784-10003TLF is a PCI Express card edge connector designed for vertical through-hole mounting. It features 164 positions with a 2.00mm pitch, supporting PCIe Gen 3 signal transmission at 8.0 Gbps per differential pair. The connector utilizes gold-plated copper alloy contacts and a nylon housing, rated for 1.1A current. It accommodates a board thickness of 2.36 mm and operates within a temperature range of -55°C to 85°C.
Verify the specific suffix 'TLF' against official datasheets to confirm lead-free compliance and packaging type. Ensure the 164-position configuration matches the target x16 slot requirements. Cross-reference the 2.00mm pitch specification with the host board layout to prevent mechanical misalignment during assembly.
Select this component when a vertical orientation and through-hole technology are required for robust mechanical stability. The 164-position count is suitable for full-length x16 links. Verify that the 2.36 mm board thickness tolerance aligns with the system's mechanical constraints before finalizing the design.
This part belongs to the HPCE series of PCI Express connectors from Amphenol ICC. The series provides solutions for various bandwidth needs, ranging from x1 to x16 link widths. These connectors are engineered to support the increasing data rates of modern computing platforms while maintaining signal integrity in demanding environments.
Consult official substitution guides for compatible alternatives. Generic cross-references may not match the precise 2.00mm pitch or 164-position geometry required for this specific application.