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The Amphenol ICC (FCI) 10018784-10012MLF is a PCIe Gen 3 card edge connector designed for vertical through-hole mounting. It features 98 positions with a 1.00mm pitch, supporting high-speed signal transmission at 8.0 Gbps per differential pair. The connector utilizes gold-plated copper alloy contacts and a nylon housing, rated for 1.1A current and 300V AC. It accommodates a board thickness of 1.56mm and includes locking features to ensure secure connection in demanding server and workstation environments.
Verify the specific ordering suffix 'MLF' against the manufacturer's latest datasheet to confirm material specifications and compliance status. Ensure that the required board thickness matches the 1.56mm specification documented for this variant. Cross-reference the pin count and pitch with the system design requirements before procurement to avoid integration errors.
Select this component when a vertical orientation and through-hole termination are required for PCIe Gen 3 applications. The 98-position count suits specific x8 or custom link widths. Compare with the TLF variant if a different board thickness or housing material is needed. Confirm that the 1.00mm pitch aligns with the edge card layout constraints.
This part belongs to the Amphenol FCI PCIe Gen 3 card edge connector family, which supports x1, x4, x8, and x16 configurations. These connectors are engineered for desktop computers, workstations, and servers. The series emphasizes signal integrity and power management capabilities essential for modern high-performance computing interfaces.
The 10018784-10012TLF is a related variant within the same series. Verify compatibility regarding board thickness tolerance and insulation material differences before substitution.