10018784-10012TLF

Overview

The Amphenol ICC (FCI) 10018784-10012TLF is a PCI Express Gen 3 card edge connector designed for vertical through-hole mounting. It features 98 positions with a 1.00mm pitch, supporting high-speed signal transmission up to 8.0 Gbps per differential pair. The connector utilizes gold-plated copper alloy contacts and a nylon housing, rated for 1.1A current and 2.36 mm board thickness.

Feature Summary

• Supports PCI Express Gen 3 standard for high-bandwidth data transfer
• Vertical orientation optimized for space-constrained server and workstation designs
• Gold-plated contacts ensure reliable electrical performance and corrosion resistance

Applications

• Server I/O expansion slots
• Workstation graphics and interface cards
• Industrial embedded systems requiring high-speed connectivity

Procurement Notes

Verify the specific suffix 'TLF' against official Amphenol documentation to confirm RoHS compliance and lead-free status. Ensure the vertical through-hole configuration matches the target PCB stack-up requirements. Cross-reference the 98-position count with the specific PCIe lane configuration needed for the application design.

Selection Notes

Select this component when a vertical PCIe Gen 3 interface is required for x16 or similar high-pin-count applications. Confirm that the 1.00mm pitch aligns with the mating card edge specifications. Verify that the through-hole soldering process is compatible with the assembly line capabilities and thermal profiles.

Part Context

This part belongs to the Amphenol FCI Basics series of high-speed interconnect solutions. It is engineered for desktop computers, workstations, and servers, providing robust signal integrity for next-generation PCI Express standards within dense electronic environments.

Replacement Considerations

Consult official Amphenol substitution guides for verified equivalent parts. Generic cross-references may not match the precise mechanical tolerances or signal integrity characteristics required for Gen 3 compliance.