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The Amphenol ICC (FCI) 10018784-10100TLF is a PCI Express Gen 3 card edge connector designed for vertical through-hole mounting. It features 36 positions with a 1.00 mm pitch, suitable for x4 link width applications. The connector utilizes gold-plated copper alloy contacts and a black nylon insulation body. It supports a current rating of 1.1 A and operates within a temperature range of -55°C to +85°C. The design accommodates a board thickness of 1.56 mm, ensuring reliable signal integrity for high-speed data transmission in server and workstation environments.
Verify the specific suffix 'TLF' confirms lead-free compliance and tin finish on the termination points as per RoHS standards. Confirm that the 36-position configuration matches the required x4 lane interface density. Ensure the vertical orientation aligns with the PCB assembly layout constraints. Cross-reference the datasheet for precise mating force specifications and retention requirements before finalizing procurement orders.
Select this component when a vertical, shrouded PCIe Gen 3 connector is required for x4 configurations. The 1.00 mm pitch offers a balance between signal density and manufacturing tolerance. Consider the through-hole mounting style for robust mechanical stability compared to surface-mount alternatives. Verify compatibility with the target card edge thickness and ensure the operating temperature range meets the environmental demands of the deployment scenario.
This part belongs to the Amphenol FCI PCI Express Gen 3 card edge connector family, which supports x1, x4, x8, and x16 link widths. The series is engineered for desktop computers, workstations, and servers, facilitating reliable communication between the motherboard and expansion cards. The 10018784 base number indicates a standard shrouded design optimized for signal integrity and mechanical durability in enterprise-grade hardware applications.
Direct substitutes include the 10018784-10201TLF (64 position) for higher lane counts and the 10018783-11100TLF (36 position) if pinout compatibility allows. Verify mechanical footprint and electrical pin assignments before swapping. Generic equivalents may lack the specified Gen 3 signal integrity performance.