10018784-10101TLF

Overview

The Amphenol ICC (FCI) 10018784-10101TLF is a PCI Express Gen 3 card edge connector designed for vertical through-hole mounting. It features 64 positions with a 1.00 mm pitch, supporting x4 link widths for server I/O applications. The connector utilizes gold-plated copper alloy contacts and a glass-filled polyamide insulation material. It operates within a temperature range of -55°C to 85°C and supports a PCB thickness of 1.56 mm.

Feature Summary

• Supports PCI Express Gen 3 signaling at 8.0 Gbps per differential pair
• Vertical through-hole termination for secure board attachment
• Gold contact plating ensures corrosion resistance and signal integrity

Applications

• Server I/O expansion cards
• Workstation peripheral interfaces
• High-bandwidth graphics and expansion modules

Procurement Notes

Verify the specific suffix 'TLF' indicates lead-free compliance and halogen-free status as per RoHS standards. Confirm that the 64-position configuration matches the required x4 lane width for the target application. Ensure the vertical orientation aligns with the mechanical assembly constraints of the host system design.

Selection Notes

Select this component when a 64-pin PCIe Gen 3 interface is required for x4 bandwidth applications. The vertical form factor suits space-constrained designs where horizontal connectors are unsuitable. Verify compatibility with the 1.56 mm PCB thickness specification to ensure proper mating depth and mechanical stability during operation.

Part Context

This part belongs to the Amphenol FCI PCIe Gen 3 card edge connector family, which provides solutions for desktop, workstation, and server environments. The series supports various link widths including x1, x4, x8, and x16 to accommodate different bandwidth requirements across consumer and enterprise markets.

Replacement Considerations

Cross-reference with other 64-position vertical PCIe Gen 3 connectors from the same manufacturer series. Ensure identical pin count, pitch, and mounting style before substitution. Verify that any alternative maintains the same thermal and electrical performance characteristics.