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The Amphenol ICC (FCI) 10018784-10103TLF is a PCI Express Gen 3 card edge connector designed for vertical through-hole mounting. It features 164 positions with a 1.00mm pitch, supporting x16 link widths for high-bandwidth applications. The connector utilizes gold-plated copper alloy contacts and is rated for 1.56mm board thickness. It belongs to the HPCE series, providing reliable signal integrity for desktop computers, workstations, and servers.
Verify the specific suffix 'TLF' against official Amphenol documentation to confirm lead-free compliance status. Ensure the part number matches the exact 164-position configuration required for x16 slot implementations. Cross-reference datasheet revisions to confirm current manufacturing status and availability constraints before finalizing procurement plans.
Select this component when designing for PCI Express Gen 3 standards requiring x16 bandwidth capacity. The vertical through-hole style suits rigid PCB assemblies where space efficiency is critical. Confirm compatibility with 1.56mm substrate thicknesses and ensure mating card dimensions align with the 1.00mm pitch specification for proper mechanical fit.
This connector is part of the HPCE series from Amphenol ICC (FCI), formerly FCI. The series provides solutions for various PCI Express generations, supporting different link widths including x1, x4, x8, and x16. This specific model targets high-density applications requiring robust signal integrity and mechanical stability in enterprise and consumer computing environments.
No public confirmed substitute part numbers are available in the provided documentation. Verify pinout compatibility and mechanical dimensions if considering alternative vendors. Consult Amphenol ICC directly for validated cross-reference options.