10018784-10110TLF

Overview

The Amphenol ICC (FCI) 10018784-10110TLF is a PCI Express Gen 3 card edge connector designed for vertical through-hole mounting. It features 36 positions with a 100mm pitch, suitable for board thicknesses of 1.56 mm to 1.57 mm. The connector utilizes cantilever contacts made of copper alloy with a gold finish of 15.0µin (0.38µm). Rated for an operating temperature range of -55°C to 85°C, it employs polyamide insulation and black housing.

Feature Summary

• Vertical through-hole mounting configuration for secure PCB integration
• Cantilever contact design ensuring reliable signal transmission
• Gold-plated copper alloy contacts for corrosion resistance
• Zero-insertion-force compatible card edge interface

Applications

• PCI Express Gen 3 expansion cards
• High-speed data acquisition modules
• Industrial control system backplanes
• Telecommunications infrastructure equipment

Procurement Notes

Verify the specific suffix 'TLF' against the manufacturer's current datasheet to confirm lead-free compliance and packaging details. Ensure the ordered quantity matches the standard reel or tube specifications provided by authorized distributors. Cross-reference the pin count and pitch requirements with the target PCB layout to prevent mechanical mismatch during assembly.

Selection Notes

Select this component when a vertical orientation is required for PCI Express Gen 3 applications. The 36-position count suits compact expansion cards. Verify that the host board accommodates the 100mm pitch and 1.56 mm thickness. Consider the cantilever contact type for ease of insertion compared to wire-wrap alternatives.

Part Context

This part belongs to the Amphenol FCI PCI Express connector family, supporting high-speed serial interfaces. It is manufactured under the Amphenol ICC division, which integrates former FCI technologies. The series is engineered for robust performance in demanding electronic environments, adhering to industry standards for signal integrity and mechanical durability.

Replacement Considerations

Direct substitutes must match the 36-position count, 100mm pitch, and vertical through-hole format. Check for equivalent cantilever contact designs from other manufacturers. Ensure compatibility with PCI Express Gen 3 electrical specifications and similar thermal ratings.