10018784-10200TLF

Overview

The Amphenol ICC (FCI) part number 10018784-10200TLF is a PCI Express Gen 3 card edge connector designed for vertical through-hole mounting. It features 36 positions with a 1.00mm pitch and utilizes gold-plated copper alloy contacts. The connector supports a maximum board thickness of 1.56 mm, carries a current rating of 1.1 A, and operates within a temperature range of -55°C to +85°C.

Feature Summary

• Supports PCI Express Gen 3 signal transmission standards
• Vertical orientation facilitates standard board stacking configurations
• Through-hole solder termination ensures robust mechanical attachment

Applications

• Desktop computer expansion slots
• Server I/O interface connections
• Workstation peripheral integration

Procurement Notes

Verify the specific suffix against official manufacturer documentation to confirm exact plating thickness and packaging configuration. Ensure compatibility with target PCB stack-up dimensions and thermal requirements before finalizing procurement orders.

Selection Notes

Select this component when designing systems requiring Gen 3 PCIe bandwidth with vertical form factors. Confirm that the host board accommodates the specified 1.56 mm maximum thickness and that the 36-position layout aligns with the required signal routing topology.

Part Context

This connector belongs to the HPCE series from Amphenol FCI, engineered for high-speed data transfer in commercial electronics. It addresses the need for reliable interconnects in environments demanding stable signal integrity across multiple generations of PCI Express protocols.

Replacement Considerations

Consult official substitution guides for equivalent 36-position vertical Gen 3 connectors. Verify pinout compatibility and mechanical footprint alignment before replacing existing inventory.