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The Amphenol ICC (FCI) 10018784-11111TLF is a PCI Express Gen 3 card edge connector designed for vertical through-hole mounting. It features 64 positions with a 0.98mm pitch, supporting high-speed signal transmission up to 8.0 Gbps per differential pair. The connector utilizes gold-plated copper alloy contacts and a nylon housing, rated for 1.1A current. It complies with RoHS standards and supports standard PCB thicknesses for desktop, workstation, and server I/O applications.
Verify the specific suffix 'TLF' indicates lead-free compliance as per manufacturer specifications. Confirm that the 64-position configuration matches the required x8 link width or equivalent signal mapping for the target design. Ensure the vertical orientation aligns with the mechanical constraints of the enclosure. Cross-reference the datasheet for precise mating force and retention characteristics.
Select this component when a 64-position PCIe Gen 3 interface is required for vertical assembly. Consider the 0.98mm pitch for trace routing density. Evaluate the through-hole termination against surface-mount alternatives for mechanical robustness. Verify compatibility with the target PCB stack-up and thermal requirements during soldering processes.
This part belongs to the Amphenol FCI PCIe Gen 3 card edge connector family, which provides solutions for various link widths including x1, x4, x8, and x16. The series is engineered for high signal integrity in data processing and communication markets. Amphenol ICC acquired FCI to expand its portfolio of high-performance interconnects for commercial electronics.
Direct substitutes within the same series include variants with different position counts such as 10018784-10012TLF (98 positions) or 10018783-10101TLF (64 positions). Ensure any replacement maintains the vertical through-hole form factor and Gen 3 speed rating. Verify mechanical dimensions and pinout compatibility before substitution.