SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Amphenol ICC (FCI) 10018784-11112TLF is a PCI Express Gen 3 card edge connector designed for vertical through-hole mounting. It features 98 positions with a 1.00mm pitch, supporting high-speed signal transmission up to 8.0 Gbps per differential pair. The connector utilizes gold-plated copper alloy contacts and a nylon housing, rated for 1.1 A current and 300 VAC voltage. It accommodates standard board thicknesses and ensures reliable connectivity for server and workstation I/O applications.
Verify the specific suffix 'TLF' against the manufacturer's latest datasheet to confirm lead-free compliance and packaging details. Confirm that the 98-position variant matches the required mechanical footprint. Cross-reference the dual read-out specification with system design requirements to ensure compatibility with the host motherboard layout.
Select this component when a vertical, through-hole PCI Express Gen 3 interface is required for 98-pin configurations. Ensure the design supports the 1.00mm pitch and accommodates the specified board thickness. Consider the 1.1 A current rating for power distribution needs and verify that the nylon housing material meets environmental operating temperature constraints.
This part belongs to the HPCE series of card edge connectors from Amphenol FCI, now part of Amphenol ICC. The series is engineered for high-performance computing environments, focusing on signal integrity and durability. The 10018784-11112TLF specifically addresses the need for robust connections in PCIe Gen 3 applications where vertical mounting is preferred for space efficiency.
Direct substitutes include other 98-position vertical PCIe Gen 3 connectors from the same HPCE family, such as 10018784-11012TLF, provided mechanical and electrical specifications align. Verify pinout compatibility and housing dimensions before substitution.