10018784-11201TLF

Overview

The Amphenol ICC (FCI) 10018784-11201TLF is a PCI Express Gen 3 card edge connector designed for vertical through-hole mounting. It features 64 positions with a 1.00 mm pitch. The component utilizes gold-plated copper alloy contacts and a nylon housing, rated for 1.1 A current and 300 VAC voltage. It supports a board thickness of 1.56 mm and operates within a temperature range of -55°C to +85°C.

Feature Summary

• Supports PCI Express Gen 3 signal integrity standards
• Vertical orientation for space-efficient PCB integration
• Gold-plated contacts ensure reliable electrical performance

Applications

• Server motherboards
• Workstation expansion cards
• Router network interfaces

Procurement Notes

Verify the specific suffix 'TLF' indicates lead-free compliance and tin/lead-free plating as per manufacturer specifications. Confirm that the 64-position configuration matches the target application requirements. Ensure the vertical through-hole mounting style aligns with the assembly process. Cross-reference the datasheet for precise mechanical dimensions and mating force characteristics before finalizing procurement.

Selection Notes

Select this connector when designing systems requiring high-speed data transfer capabilities compliant with PCIe Gen 3 standards. The vertical form factor is suitable for applications where horizontal space is limited but board height allows for protrusion. Verify compatibility with standard card edge thicknesses of 1.56 mm. Consider the 1.1 A current rating for power distribution needs on the specific circuit traces.

Part Context

This component belongs to the Amphenol FCI PCIe card edge connector family, widely used in computing infrastructure. Amphenol acquired FCI in 2016, integrating its extensive portfolio into the Amphenol ICC division. These connectors are engineered for robust performance in demanding environments, supporting the growing demand for high-bandwidth data transmission in modern electronic devices.

Replacement Considerations

Check for direct substitutes within the same series offering identical pin counts and pitch. Verify mechanical compatibility with existing PCB footprints. Ensure replacement components maintain equivalent electrical ratings and material specifications for signal integrity.