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The Amphenol ICC (FCI) 10018784-11210TLF is a PCI Express Gen 3 card edge connector designed for vertical through-hole mounting. It features 36 positions with a 0.039-inch pitch and dual read-out capability. The connector utilizes cantilever contacts and supports a standard card thickness of 0.062 inches (1.57mm). Rated for PCIe Gen 3 applications, it facilitates signal transmission for I/O cards and expansion modules in desktops, workstations, and servers.
Verify the specific suffix 'TLF' confirms lead-free compliance and halogen-free status as per RoHS standards. Confirm that the vertical orientation and 36-position count match the target PCB layout requirements. Ensure the dual-read-out specification aligns with the system's signal routing architecture to prevent impedance mismatches during assembly.
Select this component when a vertical form factor is required for PCIe Gen 3 interfaces. The 36-position count suits x8 or specific x4 configurations requiring dual-sided access. Verify that the 0.062-inch card thickness compatibility matches the host board specifications. Consider the through-hole mounting method for robust mechanical retention compared to press-fit alternatives.
This part belongs to the Amphenol FCI PCIe Gen 3 card edge connector family, which supports high-speed differential signaling at 8.0 Gbps per pair. The series offers various position counts and mounting styles to accommodate different bandwidth requirements for x1, x4, x8, and x16 link widths in enterprise and consumer computing platforms.
Direct substitutes within the same series include 10018784-10201TLF for 64-position applications and 10082378-11010TLF for press-fit variants. Cross-referencing pinout and mechanical dimensions is essential when replacing with non-Amphenol components to ensure compatibility with existing PCIe Gen 3 slot designs.