10027011-406HWLF

Description：CONN HEADER SMD R/A 6POS 2.54MM
Series：BERGSTIK® II
Mfr：Amphenol ICC (FCI)
Package：Tape & Reel (TR)

SKU:08609c4855b2 Category: Headers, Male Pins Brand: Amphenol ICC (FCI)

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Product introduction

Product Detailed Parameters

Description：CONN HEADER SMD R/A 6POS 2.54MM
Series：BERGSTIK® II
Mfr：Amphenol ICC (FCI)
Package：Tape & Reel (TR)
Connector Type：Header, Breakaway
Contact Type：Male Pin
Pitch - Mating：0.100" (2.54mm)
Number of Positions：6
Number of Rows：1
Row Spacing - Mating：-
Number of Positions Loaded：All
Style：Board to Board
Shrouding：Unshrouded
Mounting Type：Surface Mount, Right Angle
Termination：Solder
Fastening Type：Push-Pull
Contact Length - Mating：0.230" (5.84mm)
Contact Length - Post：-
Overall Contact Length：-
Insulation Height：0.095" (2.41mm)
Contact Shape：Square
Contact Finish - Mating：Tin
Contact Finish Thickness - Mating：100.0µin (2.54µm)
Contact Finish - Post：Tin
Contact Material：Phosphor Bronze
Insulation Material：-
Features：-
Operating Temperature：-65°C ~ 125°C
Ingress Protection：-
Material Flammability Rating：UL94 V-0
Insulation Color：Black
Current Rating (Amps)：3A
Voltage Rating：-

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10027011-406HWLF

Overview

The Amphenol ICC (FCI) 10027011-406HWLF is a board-to-board header connector designed for surface mount applications. It features a dual-row configuration with 40 positions and a 2.54 mm pitch. The component utilizes phosphor bronze contacts with tin plating to ensure reliable conductivity. Rated for 3 A current and 1.5 kV voltage, it operates within a temperature range of -65 °C to +125 °C. The housing is constructed from thermoplastic material meeting UL 94 V-0 flammability standards, providing robust insulation and mechanical stability for high-density interconnects.

Feature Summary

Dual-row surface mount design for vertical board-to-board connections
High dielectric strength rated at 1.5 kV for secure signal isolation
Thermoplastic housing ensures UL 94 V-0 fire resistance

Applications

Board-to-Board interconnects
Mezzanine connectors
High-density electronic assemblies

Procurement Notes

Verify the specific suffix 'HWLF' against official Amphenol documentation to confirm exact packaging and lead time requirements. Ensure compatibility with automated pick-and-place equipment due to the reel or cut tape packaging format. Cross-reference the manufacturer part number with authorized distributor catalogs to confirm current availability and compliance status before finalizing procurement orders.

Selection Notes

Select this component when a 40-position, dual-row header is required for rigid board-to-board stacking. The 2.54 mm pitch suits standard industrial and commercial layouts. Verify that the operating environment stays within the specified -65 °C to +125 °C range. Confirm that the SMD mounting style aligns with the PCB fabrication capabilities and thermal profile constraints of the assembly process.

Part Context

This connector belongs to the BergStik series by Amphenol FCI, a line known for versatile board-to-board solutions. The product falls under the broader category of headers and interconnect systems provided by Amphenol ICC. It serves as a critical interface element in modern electronics, facilitating reliable electrical pathways between stacked circuit boards in compact form factors.