100328QI

Overview

The Fairchild Semiconductor 100328QI is a TTL to ECL transceiver featuring eight functional channels with true output polarity. It operates within an extended temperature range of -40°C to +85°C and exhibits a maximum propagation delay of 5.4 ns. The device utilizes a 28-pin LCC (LCC-28) plastic package, conforming to the MO-047 outline with dimensions of 0.450 x 0.450 inches. It provides three-state outputs for bus-oriented applications.

Feature Summary

• Converts TTL logic levels to ECL standards for system interfacing
• Provides tri-state outputs to facilitate bus-driven architectures
• Supports high-speed signal transmission with low propagation delay

Applications

• TTL to ECL level translation in mixed-logic systems
• High-speed data bus drivers requiring tri-state control
• Interface circuits between TTL-based controllers and ECL peripherals

Procurement Notes

Verify component authenticity through authorized distribution channels. Confirm RoHS compliance status as indicated by non-compliant markings in available records. Ensure the LCC-28 package matches design footprint requirements. Validate operating temperature specifications against environmental constraints before integration.

Selection Notes

Select this component when direct interface between TTL inputs and ECL outputs is required. Consider the 28-pin LCC package for board space optimization. Evaluate the 5.4 ns delay against system timing budgets. Verify that the -40°C to +85°C range meets operational environment needs.

Part Context

This device belongs to the family of logic transceivers designed for bridging different logic families. It serves as a critical interface element in legacy or hybrid electronic systems where TTL and ECL technologies coexist. The specific model addresses signal integrity and speed requirements for digital communication paths.

Replacement Considerations

Consult official manufacturer documentation for verified cross-reference part numbers. Ensure any substitute maintains identical pinout configuration and electrical characteristics. Verify package compatibility and thermal performance metrics before implementation.