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The Amphenol ICC (FCI) 10061913-101CLF is a PCI Express Gen 3 card edge connector designed for vertical surface mount applications. It features a 1.0mm pitch and provides 64 positions. The connector utilizes cantilever contact types with gold plating to ensure reliable signal integrity. It supports a board thickness of 1.56 mm and operates within a temperature range of -55°C to 85°C. The housing is constructed from black nylon insulation, suitable for high-density interconnect requirements in modern computing architectures.
Verify the specific suffix 'CLF' against official Amphenol documentation to confirm lead-free compliance and material specifications. Ensure the ordering quantity aligns with manufacturer minimum order requirements. Cross-reference the Mouser part number 649-10061913-101CLF for accurate availability status. Confirm that the selected variant matches the required 64-position configuration and vertical orientation before finalizing procurement orders.
Select this component when designing systems requiring PCI Express Gen 3 compatibility with vertical mounting constraints. The 1.0mm pitch allows for high pin density in limited board areas. Verify that the target application environment falls within the specified -55°C to 85°C operating temperature range. Ensure the PCB stack-up accommodates the 1.56mm board thickness requirement for proper mechanical engagement and signal integrity.
This connector belongs to the Amphenol FCI PCIe Card Edge Connector family, which supports information and communication market growth. The product line emphasizes signal integrity performance and power management solutions. Amphenol acquired FCI in 2016, integrating these technologies into the Amphenol ICC division. This specific model represents a standard solution for desktop and server interconnect applications.
Consult official Amphenol cross-reference documents for verified substitute part numbers. Generic equivalents may not match the precise cantilever contact geometry or pitch specifications. Verify compatibility with existing PCB footprints and mating card dimensions before substitution.