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The 10076266-111TLF is a high-density female connector from the Amphenol ICC (FCI) Quickie series, designed for PCI Express expansion applications. It features a 64-position configuration with a 0.039-inch (1.00mm) pitch. The component utilizes surface mount termination and gold-plated copper alloy contacts to ensure reliable signal integrity in high-speed serial environments. Constructed with a thermoplastic insulator rated UL94 V-0, it supports robust performance in demanding electronic assemblies requiring compact form factors.
Verify that the specific suffix 'TLF' corresponds to the required tape and reel packaging format for automated manufacturing lines. Confirm that the gold plating thickness meets the project's endurance requirements. Ensure compatibility with the mating male header dimensions and keying notch positions to prevent insertion errors during assembly.
Select this part when a high-pin-count, low-profile interface is required for PCIe expansion. The surface mount option eliminates through-hole drilling constraints. Evaluate the 0.039-inch pitch against available board real estate. Consider the gold contact finish for long-term reliability in harsh operating conditions compared to tin alternatives.
This component belongs to the Quickie family of connectors, which emphasizes miniaturization and high I/O density. It serves as a critical interface between the main system board and expansion cards. The design reflects Amphenol ICC's focus on signal integrity solutions for next-generation computing architectures requiring compact yet robust mechanical connections.
Cross-reference with other 64-position PCIe female headers in the same series. Verify identical pinout configurations and mechanical footprint before substitution. Ensure mating partner specifications match exactly to maintain signal performance and physical fit.