10085429-11223TLF

Overview

The Amphenol ICC (FCI) part number 10085429-11223TLF is a PCI Express GEN 3 Card Edge connector designed for storage and server applications. It features an integrated R-Type configuration with vertical mounting via through-hole soldering. The connector supports x16 slot configurations, providing 164 positions with a 1.00mm pitch. It utilizes copper alloy contacts with gold plating to ensure reliable signal integrity. The housing is constructed from thermoplastic material, rated for operation between -55°C and +85°C. This component is specifically engineered for high-density interconnect requirements in enterprise infrastructure.

Feature Summary

• Integrated R-Type design for enhanced mechanical stability and alignment
• Vertical through-hole termination for secure PCB mounting
• Gold-plated copper alloy contacts for superior conductivity
• Optimized for high-speed PCI Express GEN 3 data transmission

Applications

• Server motherboards and backplanes
• High-performance storage subsystems
• Enterprise-grade expansion cards

Procurement Notes

Verify the current lifecycle status as this component may be discontinued or subject to limited availability. Confirm that the specific suffix matches the required pin count and orientation. Ensure compatibility with existing board layouts and mating card specifications before procurement. Cross-reference official datasheets for any recent manufacturing changes or obsolescence notices.

Selection Notes

Select this connector when a vertical, through-hole PCI Express x16 interface is required for server or storage environments. The integrated R-type feature provides necessary mechanical support for heavy cards. Verify that the 1.00mm pitch aligns with the target card edge design. Consider thermal management requirements given the operating temperature range and current ratings specified in the technical documentation.

Part Context

This component belongs to the Amphenol FCI PCI Express connector family, which specializes in high-reliability interconnect solutions for data center and industrial computing. The manufacturer, now part of Amphenol ICC, focuses on signal integrity and power delivery for next-generation computing platforms. This specific model addresses the demand for robust connections in high-density server architectures.

Replacement Considerations

Check for direct substitutes within the same product series that share identical mechanical dimensions and electrical characteristics. Verify if alternative part numbers offer updated lifecycle status while maintaining functional equivalence. Consult official cross-reference lists for approved replacements.