10108777-11033TLF

Overview

The Amphenol ICC (FCI) 10108777-11033TLF is a PCI Express card edge connector designed for vertical through-hole mounting. It features 164 positions with a 0.039-inch pitch, supporting PCIe Gen 3 applications. The component utilizes gold-plated copper alloy contacts and is rated for 1.1A current. It accommodates board thicknesses of 2.36 mm and complies with RoHS standards.

Feature Summary

• Vertical through-hole mounting configuration for secure PCB integration
• Gold-plated copper alloy contacts ensuring reliable signal transmission
• PCIe Gen 3 compatibility for high-speed data interface support

Applications

• PCI Express Gen 3 expansion cards
• High-density server backplanes
• Industrial computing motherboards

Procurement Notes

Verify the specific ordering suffix to confirm contact plating and material composition. Ensure the requested quantity aligns with manufacturer lead times. Confirm RoHS compliance status matches project requirements. Validate that the 164-position specification meets the target board design constraints before finalizing the purchase order.

Selection Notes

Select this connector when a vertical PCIe Gen 3 interface is required. The 164-position count suits standard expansion form factors. Verify that the 0.039-inch pitch matches the mating card edge specifications. Ensure the through-hole soldering process is compatible with the assembly line capabilities.

Part Context

This component belongs to the Amphenol FCI PCI Express connector family. It provides a standardized interface for high-speed peripheral connections. The product supports modern data transfer protocols while maintaining mechanical stability in demanding electronic environments.

Replacement Considerations

Consult official substitution lists for equivalent 164-position PCIe connectors. Verify pinout compatibility and mechanical footprint alignment before swapping components.