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The Amphenol ICC (FCI) 10108777-11100TLF is a PCI Express Gen 3 card edge connector designed for vertical through-hole mounting. It features 36 positions with a 1.00mm pitch, supporting a maximum board thickness of 1.56mm. The connector utilizes copper alloy contacts with gold plating and offers a current rating of 1.1A. Rated for 300VAC, it operates within a temperature range of -55°C to +85°C and provides an insulation resistance of 1 GOhms.
Verify the specific suffix against official manufacturer documentation to confirm exact contact configuration and material specifications. Ensure compatibility with target PCB stack-up dimensions, particularly regarding the supported 1.56mm board thickness limit. Confirm that the vertical mounting style aligns with mechanical enclosure constraints and thermal management requirements for the intended application environment.
Select this component when a low-profile, high-density connection is required for PCI Express applications. The vertical design optimizes space efficiency compared to horizontal alternatives. Verify that the 1.00mm pitch accommodates the necessary trace routing density on the host board. Ensure the operating temperature range meets the environmental demands of the deployment location.
This part belongs to the Amphenol FCI portfolio, acquired by Amphenol Corporation in 2016. The product line focuses on providing advanced interconnect solutions for information technology and communication markets. It emphasizes signal integrity performance and robust power management capabilities suitable for demanding electronic systems.
Consult official cross-reference guides for verified substitute part numbers from the same manufacturer family. Ensure any replacement maintains identical pin count, pitch, and mounting orientation to guarantee mechanical and electrical compatibility without redesigning the host circuit board.
The connector supports a maximum board thickness of 1.56mm.
Yes, the component is specifically designed to support PCI Express Gen 3 signal integrity requirements.