10108777-11100TLF

10108777-11100TLF

  • Description:CONN PCI EXP FMALE 36POS 0.039
  • Series:-
  • Mfr:Amphenol ICC (FCI)
  • Package:Tray

SKU:b411c113be9d Category: Brand:

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Product Detailed Parameters

  • Description:CONN PCI EXP FMALE 36POS 0.039
  • Series:-
  • Mfr:Amphenol ICC (FCI)
  • Package:Tray
  • Card Type:PCI Express™
  • Gender:Female
  • Number of Positions/Bay/Row:-
  • Number of Positions:36
  • Card Thickness:0.062" (1.57mm)
  • Number of Rows:2
  • Pitch:0.039" (1.00mm)
  • Read Out:Dual
  • Features:Board Lock, Locking Ramp
  • Mounting Type:Through Hole
  • Termination:Solder, Staggered
  • Contact Material:Copper Alloy
  • Contact Finish:Gold
  • Contact Finish Thickness:15.0µin (0.38µm)
  • Contact Type:Cantilever
  • Color:Black
  • Flange Feature:-
  • Operating Temperature:-

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10108777-11100TLF

Overview

The Amphenol ICC (FCI) 10108777-11100TLF is a PCI Express Gen 3 card edge connector designed for vertical through-hole mounting. It features 36 positions with a 1.00mm pitch, supporting a maximum board thickness of 1.56mm. The connector utilizes copper alloy contacts with gold plating and offers a current rating of 1.1A. Rated for 300VAC, it operates within a temperature range of -55°C to +85°C and provides an insulation resistance of 1 GOhms.

Feature Summary

  • Supports PCI Express Gen 3 signal integrity requirements
  • Vertical orientation facilitates compact board stacking
  • Gold-plated copper alloy contacts ensure reliable conductivity

Applications

  • High-speed data transmission modules
  • Server and storage expansion cards
  • Telecommunications infrastructure equipment

Procurement Notes

Verify the specific suffix against official manufacturer documentation to confirm exact contact configuration and material specifications. Ensure compatibility with target PCB stack-up dimensions, particularly regarding the supported 1.56mm board thickness limit. Confirm that the vertical mounting style aligns with mechanical enclosure constraints and thermal management requirements for the intended application environment.

Selection Notes

Select this component when a low-profile, high-density connection is required for PCI Express applications. The vertical design optimizes space efficiency compared to horizontal alternatives. Verify that the 1.00mm pitch accommodates the necessary trace routing density on the host board. Ensure the operating temperature range meets the environmental demands of the deployment location.

Part Context

This part belongs to the Amphenol FCI portfolio, acquired by Amphenol Corporation in 2016. The product line focuses on providing advanced interconnect solutions for information technology and communication markets. It emphasizes signal integrity performance and robust power management capabilities suitable for demanding electronic systems.

Replacement Considerations

Consult official cross-reference guides for verified substitute part numbers from the same manufacturer family. Ensure any replacement maintains identical pin count, pitch, and mounting orientation to guarantee mechanical and electrical compatibility without redesigning the host circuit board.

FAQ

What is the maximum supported printed circuit board thickness?

The connector supports a maximum board thickness of 1.56mm.

Is the connector compatible with PCI Express Gen 3 standards?

Yes, the component is specifically designed to support PCI Express Gen 3 signal integrity requirements.

10108777-11100TLF10108777-11100TLF

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