10108777-11103TLF

Overview

The Amphenol ICC (FCI) 10108777-11103TLF is a PCI Express card edge connector designed for vertical through-hole mounting. It features 164 positions with a 0.039-inch pitch, supporting high-speed data transmission. The component utilizes gold-plated contacts on copper alloy substrates to ensure reliable signal integrity and low contact resistance. Rated for 1.1 amperes per contact, it accommodates standard PCB thicknesses of 1.56 mm. This connector is engineered for robust mechanical stability in demanding electronic environments.

Feature Summary

• Vertical through-hole mounting configuration for secure board integration
• Gold-plated contacts on copper alloy for enhanced conductivity and corrosion resistance
• Optimized for PCI Express Gen 3 signal integrity requirements

Applications

• High-performance computing server backplanes
• Graphics processing unit (GPU) expansion cards
• Network interface card assemblies

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current datasheet to confirm pin count and plating specifications. Ensure compatibility with target PCB stack-up dimensions before procurement. Confirm RoHS compliance status for regulatory adherence. Cross-reference the manufacturer part number with distributor catalogs to validate availability and lead times. Request sample units for mechanical fit verification prior to mass production deployment.

Selection Notes

Select this connector when a vertical orientation and through-hole termination are required for PCI Express applications. The 164-position count suits specific form factor constraints. Evaluate the 0.039-inch pitch against available routing space. Consider the 1.1A current rating for power delivery needs. Compare against alternative pitches if density requirements differ significantly from this specification.

Part Context

This component belongs to the Amphenol FCI PCI Express connector family, which provides interconnect solutions for high-speed digital applications. The series supports various form factors and mounting styles to accommodate diverse system architectures. Amphenol ICC focuses on signal integrity and durability for enterprise and consumer electronics markets.

Replacement Considerations

Direct substitutes must match the 164 position count, 0.039-inch pitch, and vertical through-hole mounting style. Verify identical electrical ratings and material compositions for functional equivalence. Consult the manufacturer's cross-reference guide for approved alternatives.