10108777-11111TLF

Overview

The Amphenol ICC (FCI) 10108777-11111TLF is a PCI Express Gen 3 card edge connector designed for vertical through-hole mounting. It features 64 positions with a 1.00mm pitch and supports a board thickness of 2.36 mm. The contacts are made of copper alloy with gold plating, rated at 1.1 A current.

Feature Summary

• Vertical card edge connector design for PCI Express Gen 3 applications
• Through-hole solder termination for secure PCB attachment
• Gold-plated copper alloy contacts ensuring signal integrity

Applications

• PCI Express Gen 3 expansion cards
• High-speed data communication modules
• Server and storage system backplanes

Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to ensure correct contact configuration and material specifications. Confirm RoHS compliance status and lead times directly with authorized distributors or the manufacturer, as availability may vary based on production schedules and regional supply chain conditions.

Selection Notes

Select this component when a vertical, through-hole PCI Express Gen 3 interface is required. Ensure the host PCB accommodates the specified 2.36 mm thickness and that the design supports the 1.00mm pitch. Verify that the 1.1 A current rating meets the power requirements of the target application circuitry.

Part Context

This part belongs to the Amphenol FCI PCI Express connector family, which provides high-speed interconnect solutions for computing and communication markets. The series is engineered to support evolving PCIe standards, offering reliable signal transmission and mechanical stability for demanding electronic environments.

Replacement Considerations

Consult official substitution guides for compatible alternatives. Cross-reference pin counts, pitch dimensions, and mounting styles to ensure mechanical and electrical compatibility without redesigning the host PCB layout.