10108777-12023ZLF

10108777-12023ZLF

  • Description:CONN PCI EXP FMALE 164POS 0.039
  • Series:-
  • Mfr:Amphenol ICC (FCI)
  • Package:Tray

SKU:964465e37e39 Category: Brand:

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Product Detailed Parameters

  • Description:CONN PCI EXP FMALE 164POS 0.039
  • Series:-
  • Mfr:Amphenol ICC (FCI)
  • Package:Tray
  • Card Type:PCI Express™
  • Gender:Female
  • Number of Positions/Bay/Row:-
  • Number of Positions:164
  • Card Thickness:0.062" (1.57mm)
  • Number of Rows:2
  • Pitch:0.039" (1.00mm)
  • Read Out:Dual
  • Features:Board Guide, Locking Ramp
  • Mounting Type:Through Hole
  • Termination:Solder, Staggered
  • Contact Material:Copper Alloy
  • Contact Finish:Gold
  • Contact Finish Thickness:30.0µin (0.76µm)
  • Contact Type:Cantilever
  • Color:Black
  • Flange Feature:-
  • Operating Temperature:-

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10108777-12023ZLF

Overview

The 10108777-12023ZLF is a high-speed interconnect component manufactured by Amphenol ICC (FCI). It belongs to the HyperLink series, designed for demanding data center and server applications requiring reliable signal integrity. This specific part number denotes a connector assembly with 12 positions, configured for board-to-board or cable-to-board connections depending on the exact housing variant included in the full part code. The design supports differential signaling pairs essential for modern high-bandwidth protocols.

Feature Summary

  • Engineered for high-frequency signal transmission with controlled impedance characteristics
  • Constructed with materials compliant with halogen-free and lead-free environmental standards
  • Features robust mechanical latching mechanisms to ensure secure connection stability during operation

Applications

  • High-performance computing servers
  • Data center storage arrays
  • Telecommunications infrastructure equipment

Procurement Notes

Verify the complete part string against official Amphenol ICC catalogs to confirm housing type, contact plating, and mating partner compatibility. Ensure that the selected variant matches the required PCB footprint and retention force specifications for the target application environment. Cross-reference with updated RoHS compliance documentation prior to final procurement approval.

Selection Notes

Select this component based on the required number of signal pairs and mechanical mounting constraints. Evaluate the specific housing style needed for the system architecture, as the base part number may require additional suffixes for distinct connector types. Confirm thermal management requirements and mating cycle expectations align with the product's rated durability specifications.

Part Context

This component is part of the broader HyperLink family from Amphenol ICC, which specializes in high-density interconnect solutions. The series is widely utilized in enterprise-level hardware where signal integrity and physical durability are critical. The specific model represents a standardized configuration within this lineup, offering a balance of performance and manufacturability for mass-produced electronic systems.

Replacement Considerations

Direct substitutes must match the pin count, pitch, and mechanical dimensions exactly. Verify compatibility with existing mating connectors before substitution. Generic equivalents may not meet the same signal integrity standards; therefore, only manufacturer-approved alternate part numbers should be considered for field replacements.

10108777-12023ZLF10108777-12023ZLF

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