10108777-12102TLF

Overview

The Amphenol ICC (FCI) 10108777-12102TLF is a high-speed mezzanine connector system designed for dense board-to-board applications. It features a 1.00mm pitch with 12 positions, supporting data rates up to 16 Gbps per lane. The connector utilizes a gold-plated phosphor bronze contact material for reliable signal integrity and low insertion loss. It offers a mating height of 0.95mm and supports surface mount termination for automated assembly processes.

Feature Summary

• Supports high-speed differential signaling with controlled impedance
• Compact form factor enables dense board stacking configurations
• Gold-plated contacts ensure durable electrical performance

Applications

• High-performance computing server backplanes
• Storage area network interconnects
• Telecommunications infrastructure equipment

Procurement Notes

Verify the specific suffix codes against the official datasheet to confirm plating thickness and tape/reel specifications. Ensure that the selected variant matches the required mating height and retention force for your mechanical design constraints before finalizing procurement orders.

Selection Notes

Select this component when space constraints require a 1.00mm pitch interface with high-speed data transmission capabilities. Consider the total stack-up height and mating cycle requirements to ensure compatibility with the opposing connector housing and PCB layout guidelines provided in the manufacturer's documentation.

Part Context

This part belongs to the FCI High Speed Mezzanine Connector family, engineered for demanding electronic environments requiring robust signal integrity. It complements other connectors in the series by offering standardized dimensions and electrical characteristics suitable for next-generation hardware architectures.

Replacement Considerations

Direct substitutes include other 1.00mm pitch mezzanine connectors from compatible manufacturers such as Molex or Samtec, provided they match the 12-position count and 16 Gbps speed rating. Verify pinout compatibility and mechanical footprint alignment before substitution.