10108777-13023TLF

Overview

The Amphenol ICC (FCI) part number 10108777-13023TLF is a PCI Express card edge connector designed for high-speed data transmission. It supports PCI Express Gen 3 standards and features a vertical through-hole mounting style with solder termination. The connector provides 64 positions with a 100mm pitch, accommodating a board thickness of 2.36 mm. Constructed with copper alloy contacts plated in gold, it ensures reliable signal integrity. The housing material is specified, and the component carries RoHS compliance details.

Feature Summary

• Supports PCI Express Gen 3 high-speed data transmission standards
• Vertical through-hole mounting configuration for secure PCB integration
• Gold-plated copper alloy contacts to ensure signal integrity
• Zero insertion force design for simplified mating operations

Applications

• High-performance computing systems requiring PCIe Gen 3 interfaces
• Server backplanes and storage expansion cards
• Industrial automation control boards
• Telecommunications infrastructure equipment

Procurement Notes

Verify the exact suffix 'TLF' against the manufacturer's current datasheet to confirm plating specifications and lead-free status. Ensure the 64-position count and 100mm pitch match the target PCB layout dimensions. Confirm that the vertical orientation aligns with the enclosure clearance requirements. Cross-reference the RoHS declaration with the latest environmental compliance reports from Amphenol ICC.

Selection Notes

Select this connector when a vertical form factor is required for PCI Express Gen 3 applications. The 64-position capacity suits standard x8 or x16 slot implementations. Verify that the 2.36 mm board thickness tolerance fits the assembly constraints. Consider the through-hole soldering process compatibility during the manufacturing phase. Ensure the gold contact plating meets the system's corrosion resistance needs.

Part Context

This component belongs to the Ariat series of card edge connectors by Amphenol ICC (FCI). The series is engineered for demanding server and storage environments. It complements other FCI interconnect solutions by providing robust mechanical retention and electrical performance. The product line emphasizes signal integrity and durability for next-generation computing architectures.

Replacement Considerations

Check for direct substitutes within the same Ariat family with identical pin counts and pitch. Verify cross-compatibility with existing tooling and PCB footprints before switching. Consult official change notifications for any updated suffix variations.