10111616-003LF

Overview

The Amphenol ICC (FCI) 10111616-003LF is a standard card edge connector receptacle featuring 74 positions. It utilizes a dual-sided contact configuration with a 2.54 mm pitch and a 1.27 mm board thickness tolerance. Designed for vertical through-hole mounting, this HPCE series component supports power and signal applications with a 9 A current rating. The unit operates within a temperature range of -55°C to +105°C and provides insulation resistance of 5 GOhms at 500 VDC.

Feature Summary

• Dual-sided female contacts enable connection to both edges of the circuit board.
• Vertical orientation facilitates direct board stacking or perpendicular mating.
• HPCE series construction ensures robust mechanical retention for high-density layouts.

Applications

• High-density backplane interconnects
• Industrial control system modules
• Telecommunications infrastructure cards

Procurement Notes

Verify the specific suffix against official Amphenol documentation to confirm pin count and pitch variations. Ensure the target PCB accommodates the required 1.27 mm thickness tolerance for proper insertion. Confirm RoHS compliance status via the latest datasheet revision before integration into regulated assemblies.

Selection Notes

Select this model when dual-edge connectivity is required for high-pin-count applications. The 2.54 mm pitch suits general-purpose signal routing rather than ultra-high-speed differential pairs. Verify that the assembly process supports through-hole press-fit termination methods compatible with the specified header design.

Part Context

This component belongs to the HPCE (High Performance Card Edge) family from Amphenol FCI. The series is engineered for demanding environments requiring reliable electrical connections in compact form factors. It serves as a critical interface between carrier boards and plug-in modules in modular electronic systems.

Replacement Considerations

Cross-reference part number 10111616-001LF for alternative position counts within the same series. Verify mechanical footprint compatibility before substitution to ensure proper PCB layout alignment and housing dimensions match the original design requirements.