10112690-F01-24ULF

Headers, Male Pins Overview

The Amphenol ICC (FCI) 10112690-F01-24ULF is a Minitek series header designed for horizontal surface mount applications. It features a thermoplastic housing in black color and utilizes gold-plated contacts to ensure reliable signal transmission. This component belongs to the Minitek family, which provides versatile interconnect solutions for various electronic assemblies.

Headers, Male Pins Feature Summary

• Horizontal surface mount configuration for efficient PCB integration
• Minitek series design ensuring robust mechanical stability
• Gold contact finish for enhanced conductivity and corrosion resistance

Headers, Male Pins Applications

• General electronic equipment assembly
• Consumer electronics internal connections
• Industrial control system wiring

Headers, Male Pins Procurement Notes

Verify the specific pin count and pitch requirements against the target circuit design before procurement. Confirm that the horizontal orientation aligns with the board layout constraints. Ensure compatibility with standard reflow soldering profiles for surface mount technology components.

Headers, Male Pins Selection Notes

Select this part when a low-profile, horizontal header is required for wire-to-board or cable-to-board connections. The Minitek series offers flexibility in row and position configurations. Evaluate thermal management needs as the thermoplastic housing has specific temperature ratings.

Headers, Male Pins Part Context

This component is part of the Amphenol FCI Minitek product line, known for providing cost-effective and reliable interconnect solutions. The Minitek series includes various header types suitable for diverse applications ranging from data communication to industrial controls, emphasizing ease of use and durability.

Headers, Male Pins Replacement Considerations

Check for direct substitutes within the same Minitek series offering identical pin counts and mounting styles. Verify that alternative headers maintain the same electrical ratings and mechanical dimensions to ensure seamless integration without redesigning the PCB footprint.