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10112690-G05-09ALF is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Amphenol ICC (FCI). Its product description is CONN HEADER. Review the specifications below when checking this part for your BOM.
The Amphenol ICC (FCI) 10112690-G05-09ALF is a Minitek header connector designed for surface mount applications. It features a right-angle configuration with 9 positions arranged in a single row. The connector utilizes a 2.00mm pitch to facilitate compact circuit board layouts. Contact materials are constructed from copper alloy, finished with tin plating to ensure reliable electrical conductivity and solderability. The housing is manufactured from black thermoplastic material, providing structural integrity and insulation.
Verify the specific ordering suffix 'G05-09ALF' against the manufacturer's current datasheet to confirm pin count and plating specifications. Ensure compatibility with automated pick-and-place equipment due to the surface mount form factor. Confirm RoHS compliance status through official documentation prior to final procurement authorization.
Select this component when a low-profile, right-angle connection is required for high-density signal routing. The 2.00mm pitch offers a balance between contact density and manufacturing ease. Consider the single-row layout for simplified trace routing compared to multi-row alternatives. Verify that the housing material rating meets the thermal requirements of the reflow soldering process.
This part belongs to the Minitek family of connectors produced by Amphenol ICC (FCI). The series is characterized by its modular nature, allowing mixed mating options across various connector types within the same pitch system. This specific model represents a standard header variant intended for general-purpose interconnect solutions in compact electronic assemblies.
Direct substitutes must match the 9-position count, 2.00mm pitch, and right-angle surface mount orientation. Verify that alternative manufacturers provide identical housing dimensions and terminal locking mechanisms to ensure mechanical fit within existing enclosures without redesigning the printed circuit board footprint.
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