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10112690-T03-13ULF is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Amphenol ICC (FCI). Its product description is CONN HEADER SMD R/A 26POS 2MM. Review the specifications below when checking this part for your BOM.
The Amphenol ICC (FCI) 10112690-T03-13ULF is a Minitek header connector designed for wire-to-board applications. It features a 13-position configuration with a 2.54mm pitch, arranged in a single row. The component utilizes male pin contacts made of copper alloy with tin over nickel plating to ensure reliable conductivity and corrosion resistance. Designed for surface mount installation, it employs right-angle terminals to facilitate compact PCB layouts. The housing is constructed from black thermoplastic material, providing structural integrity and electrical insulation.
Verify the specific suffix 'ULF' indicates lead-free compliance when sourcing. Confirm that the 13-position count matches the target harness requirements. Ensure the right-angle orientation aligns with the mechanical assembly constraints. Cross-reference the tin plating specification against environmental exposure conditions to guarantee long-term performance stability.
Select this part for applications requiring a low-profile, single-row connection between wires and a circuit board. The 2.54mm pitch is standard for general-purpose signal transmission. Consider the right-angle form factor if vertical clearance is limited. Validate that the current carrying capacity meets the system's electrical load requirements before finalizing the design.
This component belongs to the Minitek series by Amphenol ICC (FCI), a line known for cost-effective wire-to-board solutions. The 10112690 base number identifies the header family, while the T03 suffix typically denotes the specific contact type and arrangement. This series is widely used in mass-produced electronic devices due to its standardized dimensions and reliable mating characteristics.
Compatible substitutes include other 13-position, 2.54mm pitch right-angle headers from the same manufacturer or third-party vendors. Ensure the replacement maintains the same terminal style and housing material properties. Verify that any alternative part supports the required surface mount process without altering the PCB footprint dimensions.
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