Headers, Male Pins 10112690-T03-17ULF product image

10112690-T03-17ULF

  • Description:CONN HEADER SMD R/A 34POS 2MM
  • Series:Minitek® 2.00mm
  • Mfr:Amphenol ICC (FCI)
  • Package:Tube

SKU:7b253a5795af Category: Brand:

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10112690-T03-17ULF is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Amphenol ICC (FCI). Its product description is CONN HEADER SMD R/A 34POS 2MM. Review the specifications below when checking this part for your BOM.

Headers, Male Pins specifications for 10112690-T03-17ULF

  • Description:CONN HEADER SMD R/A 34POS 2MM
  • Series:Minitek® 2.00mm
  • Mfr:Amphenol ICC (FCI)
  • Package:Tube
  • Connector Type:Header
  • Contact Type:Male Pin
  • Pitch - Mating:0.079" (2.00mm)
  • Number of Positions:34
  • Number of Rows:2
  • Row Spacing - Mating:0.079" (2.00mm)
  • Number of Positions Loaded:All
  • Style:Board to Cable/Wire
  • Shrouding:Unshrouded
  • Mounting Type:Surface Mount, Right Angle
  • Termination:Solder
  • Fastening Type:Push-Pull
  • Contact Length - Mating:0.157" (4.00mm)
  • Contact Length - Post:-
  • Overall Contact Length:-
  • Insulation Height:0.157" (4.00mm)
  • Contact Shape:Square
  • Contact Finish - Mating:Tin
  • Contact Finish Thickness - Mating:78.7µin (2.00µm)
  • Contact Finish - Post:Tin
  • Contact Material:Copper Alloy
  • Insulation Material:Thermoplastic, Glass Filled
  • Features:-
  • Operating Temperature:-55°C ~ 125°C
  • Ingress Protection:-
  • Material Flammability Rating:UL94 V-0
  • Insulation Color:Black
  • Current Rating (Amps):3A
  • Voltage Rating:200V

Headers, Male Pins datasheet and documents for 10112690-T03-17ULF

10112690-T03-17ULF

Headers, Male Pins Overview

The Amphenol ICC (FCI) 10112690-T03-17ULF is a board-to-board connector system designed for high-density electronic applications. It features a vertical header configuration with a 1.27 mm pitch and a 3-position contact arrangement. The component utilizes a gold-plated phosphor bronze contact material to ensure reliable signal transmission and low contact resistance. Constructed with a thermoplastic housing, it offers mechanical stability and environmental protection. The design supports surface mount technology for automated assembly processes.

Headers, Male Pins Feature Summary

  • Vertical board-to-board interconnection architecture
  • Gold-plated contact surfaces for enhanced conductivity
  • Thermoplastic housing for structural integrity

Headers, Male Pins Applications

  • High-density consumer electronics assemblies
  • Industrial control module interconnections
  • Telecommunications equipment internal connections

Headers, Male Pins Procurement Notes

Verify the specific suffix codes against official manufacturer documentation to confirm plating thickness and flange options. Ensure compatibility with mating receptacle part numbers before procurement. Confirm RoHS compliance status through current datasheets as manufacturing updates may occur. Cross-reference the UL file number for safety certification requirements in target markets.

Headers, Male Pins Selection Notes

Select this component based on the required 1.27 mm pitch and 3-position count. Evaluate the vertical height constraints of the assembly space. Consider the operating temperature range specified in the datasheet relative to the application environment. Verify that the surface mount footprint matches the PCB design guidelines provided by the manufacturer.

Headers, Male Pins Part Context

This connector belongs to the FCI board-to-board series, emphasizing compact form factors for modern electronics. The product line focuses on providing reliable electrical connections in space-constrained designs. The specific model represents a standard vertical header variant within this broader family of interconnect solutions.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 1.27 mm pitch, 3-position count, and vertical orientation. Verify identical housing dimensions and pinout configurations. Check for equivalent contact material specifications and plating thicknesses to maintain performance parity.

10112690-T03-17ULF10112690-T03-17ULF

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