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10114828-11210LF is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Amphenol ICC (FCI). Its product description is CONN HEADER SMD 10POS 1.25MM. Review the specifications below when checking this part for your BOM.
The Amphenol ICC (FCI) part number 10114828-11210LF is a Minitek® 1.25mm wire-to-board connector header. It features a single row with 10 positions and a pitch of 0.049 inches (1.25mm). The component utilizes surface mount termination for PCB integration. Contact plating is specified as gold over nickel to ensure reliable signal transmission. The housing is constructed from liquid crystal polymer (LCP), providing high thermal stability and UL94 V-0 flammability rating. Rated for 1A current at 125V, it operates within a temperature range of -40°C to 105°C.
Verify the specific ordering suffix to confirm pin count and termination style match project requirements. Ensure compatibility with existing PCB footprint designs before procurement. Confirm that the gold contact plating thickness meets signal integrity standards for the intended application environment. Check for RoHS compliance documentation if required by regional regulations.
Select this component when a low-profile, surface-mount wire-to-board solution is required for 1.25mm pitch applications. Consider the 1A current rating and 125V voltage limit against circuit demands. Evaluate the surface mount orientation against available board space and mechanical constraints. Compare against other Minitek series options if different termination styles or higher pin counts are needed.
This connector belongs to the Minitek® Multipitch™ family produced by Amphenol ICC (FCI). The series focuses on compact, reliable interconnects for dense electronic assemblies. It complements other Minitek variants offering different pitches and termination methods. The product line supports various industries requiring robust signal and power distribution in limited spaces.
Direct substitutes must maintain the 1.25mm pitch, 10-position configuration, and surface mount termination. Verify that alternative headers share identical LCP insulation properties and gold contact plating specifications. Ensure mechanical dimensions match the original PCB land pattern to avoid rework.
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