10114828-13103LF

Headers, Male Pins Overview

The Amphenol ICC (FCI) 10114828-13103LF is a surface mount header connector featuring a 1.25mm pitch and three positions. It utilizes gold-plated phosphor bronze contacts housed in natural liquid crystal polymer insulation rated UL94 V-0. Designed for board-to-board applications, this component supports a maximum current of 1A at 125V. The right-angle termination ensures reliable soldering to printed circuit boards while maintaining signal integrity in compact electronic assemblies.

Headers, Male Pins Feature Summary

• Surface mount termination for automated PCB assembly
• Gold-plated phosphor bronze contacts for corrosion resistance
• Natural LCP insulation with UL94 V-0 flammability rating

Headers, Male Pins Applications

• Consumer electronics internal interconnects
• Industrial control board connections
• Telecommunications equipment modules

Headers, Male Pins Procurement Notes

Verify the specific suffix 'LF' confirms lead-free compliance per RoHS standards. Confirm the package type matches surface mount requirements rather than through-hole variants. Ensure the pin count aligns with the three-position specification to avoid mating errors with larger headers.

Headers, Male Pins Selection Notes

Select this component when a low-profile, right-angle connection is required for tight spatial constraints. The 1.25mm pitch offers a balance between density and manufacturability. Consider the thermal stability of LCP if operating near high-temperature soldering processes or environments.

Headers, Male Pins Part Context

This part belongs to the FCI Basics series, which provides cost-effective interconnect solutions. Amphenol acquired FCI, integrating these connectors into their broader portfolio. The series focuses on standard board-to-board applications requiring reliable electrical performance without complex locking mechanisms.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 1.25mm pitch, 3-position count, and surface mount orientation. Verify contact material and plating thickness to ensure equivalent conductivity and durability. Check mechanical dimensions for compatibility with existing PCB footprints.