10118615-217007LF

Headers, Male Pins Overview

The Amphenol ICC (FCI) part number 10118615-217007LF is a vertical, breakaway header connector designed for through-hole mounting. It features 17 positions with a 2.54mm pitch. The connector has a current rating of 3A and utilizes copper alloy contacts. Packaging is provided in bags.

Headers, Male Pins Feature Summary

• Vertical orientation for standard board insertion
• Breakaway design allows for flexible circuit board sizing
• Through-hole termination method ensures secure mechanical attachment

Headers, Male Pins Applications

• General purpose electronic assemblies
• Industrial control systems
• Consumer electronics manufacturing

Headers, Male Pins Procurement Notes

Verify the specific pin count and pitch against the target application requirements before ordering. Confirm that the through-hole mounting style matches the PCB layout. Ensure the 3A current rating is sufficient for the intended electrical load to prevent overheating or performance degradation during operation.

Headers, Male Pins Selection Notes

Select this component when a vertical, breakaway header is required for through-hole assembly. The 2.54mm pitch is standard for many general-purpose applications. Consider the 3A current rating and copper alloy contact material for reliable signal and power transmission in standard operating environments.

Headers, Male Pins Part Context

This connector belongs to the Amphenol ICC (FCI) portfolio of interconnect solutions. It is categorized as a wire-to-board or board-to-board header depending on the mating interface. The breakaway feature provides versatility in manufacturing by allowing users to separate the connector into smaller sections if needed.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 17-position count, 2.54mm pitch, vertical orientation, and through-hole termination. Verify that any alternative component meets the same 3A current rating and physical dimensions to ensure compatibility with existing PCB footprints and assembly processes.